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US Microelectronics Packaging Ecosystem: Challenges and Opportunities. (arXiv:2310.11651v1 [eess.SY])
cs.CR updates on arXiv.org arxiv.org
The semiconductor industry is experiencing a significant shift from
traditional methods of shrinking devices and reducing costs. Chip designers
actively seek new technological solutions to enhance cost-effectiveness while
incorporating more features into the silicon footprint. One promising approach
is Heterogeneous Integration (HI), which involves advanced packaging techniques
to integrate independently designed and manufactured components using the most
suitable process technology. However, adopting HI introduces design and
security challenges. To enable HI, research and development of advanced
packaging is crucial. The …
advanced challenges chip cost designers devices ecosystem features industry integrate integration microelectronics opportunities packaging semiconductor silicon solutions techniques