Jan. 10, 2022, 2:20 a.m. | Gino Chacon, Tapojyoti Mandal, Johann Knechtel, Ozgur Sinanoglu, Paul Gratz, Vassos Soteriou

cs.CR updates on arXiv.org arxiv.org

Industry is moving towards large-scale systems where processor cores,
memories, accelerators, etc.\ are bundled via 2.5D integration. These various
components are fabricated separately as chiplets and then integrated using an
interconnect carrier, a so-called interposer. This new design style provides
benefits in terms of yield as well as economies of scale, as chiplets may come
from various third-party vendors, and be integrated into one sophisticated
system. The benefits of this approach, however, come at the cost of new
challenges for …

ar attacks countermeasures systems

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