BackMon: IC Backside Tamper Detection using On-Chip Impedance Monitoring

ePrint Report: BackMon: IC Backside Tamper Detection using On-Chip Impedance Monitoring

Tahoura Mosavirik, Shahin Tajik

The expansion of flip-chip technologies and a lack of backside protection make the integrated circuit (IC) vulnerable to certain classes of physical attacks mounted from the IC’s backside. Laser-assisted probing, electromagnetic, and body-basing injection attacks are examples of such attacks. Unfortunately, there are few countermeasures proposed in the literature, and none are available commercially. Those that do exist are not only expensive but are incompatible …

attacks body chip detection eprint report expansion flip injection injection attacks integrated circuit laser monitoring physical physical attacks protection report technologies vulnerable